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SAN JOSE, CA, August 15, 2022 — On August 10, OCP China Day 2022 was held in Beijing, hosted by the Open Compute Project Foundation (OCP) and organized by Inspur Information, a leading IT infrastructure solutions provider. By leveraging a global collaborative innovation approach and addressing key issues of data center infrastructure sustainability, open computing is becoming an anchor for data center innovation. OCP China Day is Asia’s largest annual technology conference and provides the widest coverage of open computing. It is celebrating its 4th anniversary with nearly 1,000 IT engineers and data center professionals in attendance.
With the theme of “Open Forward: Green, Convergence, Empowering”, this year’s Summit will be attended by more than 30 world-renowned companies, universities and research institutions, including OCP Foundation, Inspur Information, Intel, Meta, Samsung, Western Digital, Inflame, Nvidia, Microsoft, Alibaba. Cloud, Baidu, Tencent Cloud, Tsinghua University, etc. To discuss topics such as data center infrastructure innovation, sustainable development and industrial ecology.
Driving data center sustainability with green technology
“The trust our colleagues and outside companies have in OCP is the foundation of the community’s growing impact,” said Steve Helvey, OCP’s vice president of channels. “Open source hardware is designed and verified by a variety of experts, creating confidence for companies that purchase and deploy these devices. And efficient hardware designs in the community are helping to create confidence in the sustainability of data centers that can reduce carbon emissions. In the future, the community’s research projects include heat recovery, air conditioning, and more.” Locations and other areas encourage greater reliance on data center infrastructure innovation.
As data centers emerge as new infrastructures, there is a growing concern for the sustainability of data centers, such as the use of renewable energy, reuse, recycling, and liquid cooling technologies to reduce water consumption. The resulting green carbon footprint is one of OCP’s main research priorities.
The newly formed Cooling Environment Project is OCP’s largest cross-industry collaboration, with representatives from multiple companies and industries focusing on data center liquid cooling technologies. The project integrates five sub-projects including Advanced Cooling Solutions (ACS) and Advanced Cooling Facilities (ACF). For example, ACS cold plate sub-project, ACS door heat exchanger sub-project, ACS immersion sub-project, waste heat recycling sub-project, etc. The goal is to fix the aforementioned sub-projects and physical interfaces at the project termination level. Coordination between different cooling systems in data centers to accelerate data center innovation.
William Chen, director of product planning for Inspur Information’s server department, said the rapidly growing scale of data centers is putting new pressures on global sustainability. Therefore, data centers must adopt and introduce new technologies to reduce environmental impact as sustainability is very important. Various solutions, liquid cooling innovations, improved data center layouts and clean energy use help reduce energy consumption and overall environmental impact.
In addition to being actively involved in OCP’s Cooling Environments project, many community members have contributed to the sustainability of the data center. For example, Inspur Information has adopted a company-level strategy of “all in liquid cooling” and has built the largest liquid-cooled data center production and R&D base in Asia. The four-product series includes general purpose servers, high density, rack servers and AI servers, all of which support cold plate cooling.
Accelerating data center innovation with international cooperation
The Open Compute Project has created a new global collaboration model that removes technical barriers and makes hardware innovation faster than ever before.
Hu Zhenyu, corporate vice president of Baidu ABC Cloud Business Group, said that as data centers move toward centralization and scalability, IT infrastructure is facing major challenges in terms of performance, power consumption, and deployment. Open Compute is committed to moving data center equipment design standards from closed source to open source, accelerating the implementation of new technologies, facilitating the construction and efficient development of green data centers, and sharing IT infrastructure, including products, specifications, and intellectual property. .
With over 10 years of development, OCP Innovations now covers all aspects of data center design, development and management. This includes heterogeneous computing, edge computing and other forward-looking technologies. The newly released Open Rack 3.0 specification offers further improvements in terms of space utilization, load carrying, power delivery and liquid cooling support. The design of the ORv3 connectors enables blind insertion, and servers, when added to a rack, can be inserted directly into the liquid cooling compartment. In the field of high-speed networking, the OCP Mezz (NIC) specification has become the industry standard for I/O options, and SONIC/SAI has been widely deployed commercially in the Internet, communications and other industries. The OAM specification is for Domain-Specific Architecture Design (DSA), a standard that supports access to multiple AI chips that can meet the explosive growth of AI worldwide, while the BoW specification for chiplet interconnect allows chip manufacturers to mix and match chips using different Manufacturing technologies to enable high-performance chip design at various process stages. The DC-SCM standard (Data Security Security Management Module) defines a security control management module that is separated from the motherboard, enabling the decoupling of computing and security management components, making motherboard design even simpler.
Dr. Weifeng Zhang, Chief Scientist of Heterogeneous Computing at Alibaba Cloud, pointed out that in recent years, there has been a trend towards decentralizing computing system architecture to compensate for the slowdown in Moore’s Law. With the continuous development of chip and interactive technologies, the interaction between computing devices has become the key to the sustainable development of computing in the future.
Open hardware, open software, and hardware-software stacking have emerged as prominent trends in data center development. This has led vendors to shift from a closed proprietary mindset to an emphasis on open source and collaboration. This openness will allow more companies to contribute to data center infrastructure innovation and encourage more innovative ideas through global collaboration.
Traditional industries embrace open computing for ecological enhancement.
Open computing fosters standardization and ecosystem building through open collaboration, building consensus and aligning infrastructure to open source specifications. This facilitates the rapid implementation of more innovative technologies. This industrial ecosystem enables hyper-scale data centers to widely implement open computing technologies, and encourages industrial users and even SMEs to start deploying ad hoc solutions based on open computing.
Open computing is accelerating to spread from the Internet to other industries, such as telecommunications, finance, gaming, healthcare, automated manufacturing, etc. It will reach 21.9% by 2025.
Open computing’s unique technical edge, sophisticated design thinking, and ecosystem collaboration are breaking down boundaries in data center innovation and enabling the integration of complementary technologies. In the future, global collaboration and co-innovation revolving around open computing will drive further data center growth while addressing global issues such as carbon emissions.
Information about Inspur
Inspur Data is a leading provider of data center infrastructure, cloud computing and AI solutions. It is the world’s 2nd largest server manufacturer. Through engineering and innovation, Inspur Information provides cutting-edge computer hardware design and a wide range of product offerings to address important technology areas such as open computing, cloud data center, AI and deep learning. Performance-optimized and purpose-built, our world-class solutions enable our customers to meet specific workloads and real-world challenges.
Source: Inspur
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